KIOXIA Introduces UFS Ver. 4.1 Embedded Memory Devices for Car Tech Applications
KIOXIA America, Inc. has taken a significant step forward in the world of embedded memory technology, announcing the sampling of new Universal Flash Storage (UFS) Ver. 4.1 devices designed specifically for automotive applications.
These new UFS 4.1 devices deliver a notable performance boost, offering approximately 2.1 times sequential read performance, 2.5 times sequential write performance, 2.1 times random read performance, and 3.7 times random write performance compared to KIOXIA's previous UFS 3.1 generation.
The UFS 4.1 devices are engineered to meet the rigorous demands of next-generation in-vehicle systems. They are compliant with the UFS 4.1 Specification and include WriteBooster related extensions, such as WriteBooster Buffer Resizing and Pinned Partial Flush Mode. These extensions aim to further enhance the devices' performance and reliability.
The new UFS 4.1 devices are available in capacities of 128 GB, 256 GB, 512 GB, and 1 terabyte (TB). Sample shipments of the 1TB UFS 4.1 device began in June, while the 128 GB and 256 GB devices began in July.
In addition to their performance improvements, the new UFS 4.1 devices also boast enhanced diagnostic capabilities. A newly added vendor-specific device health descriptor simplifies device status monitoring and predictive maintenance, making them ideal for the demanding environment of automotive applications.
The devices integrate KIOXIA's 8th generation BiCS FLASH 3D flash memory and a controller in a JEDEC-standard package. This 3D flash memory introduces CBA (CMOS directly Bonded to Array) technology, an architectural innovation that marks a step-change in flash memory design.
It's worth noting that Samsung is also currently developing UFS 4.1 embedded storage devices for automotive applications. This competition is expected to drive further innovation and performance improvements in the field.
The new UFS 4.1 devices meet AEC-Q100/104 Grade 2 standards, supporting case temperature up to 115°C. This high temperature compatibility makes them suitable for the harsh conditions often encountered in automotive environments.
In conclusion, KIOXIA's new UFS 4.1 devices represent a significant leap forward in embedded memory technology, offering improved performance, enhanced diagnostics, and high temperature compatibility. These advancements are set to revolutionise the automotive industry, paving the way for more efficient and reliable in-vehicle systems.
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