Groundbreaking Introduced Six-Pack SiC Power Module in Automotive Industry for Electric Vehicle Inverters

Infineon Technologies AG has announced the launch of a new automotive power module, the HybridPACK Drive CoolSiC, which is set to revolutionize the electric vehicle (EV) industry. This power module is based on the CoolSiC trench MOSFET technology and is particularly beneficial for vehicles with 800 V battery systems and larger battery capacity.

The CoolSiC trench MOSFET technology offers high-power density and high-performance, making it ideal for applications that require efficient and reliable power management. The power module allows for greater driving range, smaller battery size, and optimized system size and cost, making it a game-changer in the EV industry.

The HybridPACK Drive CoolSiC power module is fully qualified to the AQG324 norm for automotive power modules, ensuring its reliability and compliance with industry standards. It is available in two versions with different chip counts, resulting in either a 400 A or 200 A DC rating version in the 1200 V class. The full-bridge module boasts a 1200 V blocking voltage.

Infineon emphasizes the reliability of the Automotive CoolSiCTM MOSFETs, with a focus on short circuit robustness and high cosmic ray and gate-oxide robustness. The first-generation of CoolSiC automotive MOSFET technology is optimized for use in traction inverters, focusing on lowest conduction losses under partial load conditions. This design allows the power module to achieve higher power of up to 250 kW in the 1200 V class.

Combined with low switching losses of silicon carbide MOSFETs, this enables an efficiency gain in inverter operation compared to silicon IGBTs. The HybridPACK Drive CoolSiC power module offers an easy upscale path from silicon to silicon carbide with the same footprint, making it a practical choice for manufacturers looking to transition to silicon carbide technology.

The Infineon CoolSiC™ MOSFET-based HybridPACK Drive Power Module is planned to be used in the Volkswagen ID. series electric vehicle platform for the traction inverter. Dr. Jin-Hwan Jung, Head of the Electrification Development Team at Hyundai Motor Group, stated that the 800 V system of the Electric Global Modular Platform (E-GMP) represents the technological basis for the next generation of electric vehicles with reduced charging time.

Mark Münzer, Head of Innovation and Emerging Technology at Infineon, stated that as the price of SiC devices significantly decreases, the commercialization of SiC solutions will accelerate, resulting in more cost-efficient platforms adopting SiC technology to improve the range of electric vehicles. The introduction of the HybridPACK Drive CoolSiC power module is a testament to Infineon's commitment to driving innovation in the EV industry.

Groundbreaking Introduced Six-Pack SiC Power Module in Automotive Industry for Electric Vehicle Inverters