Chinese companies YMTC and CXMT collaborate to boost native HBM production in China, combining their hybrid bonding and DRAM technology expertise.

In the global semiconductor industry, China is making significant strides in advancing its domestic production, particularly in the realm of High Bandwidth Memory (HBM). This high-performance memory solution is primarily used in high-end AI accelerators and GPUs, serving as a key growth engine for the memory market.

Yangtze Memory Technologies Corp. (YMTC) and ChangXin Memory Technologies (CXMT) are leading the charge in this area. YMTC's 'Xtacking' architecture, a leading implementation of hybrid bonding, has been instrumental in mass-producing 3D NAND. Now, these two companies are collaborating on the development and production of HBM3 and HBM3E to improve the performance and efficiency of advanced memory solutions.

CXMT has already produced HBM2 and is aggressively pursuing HBM3 on an accelerated timetable. Analysts predict that CXMT will produce HBM3 and HBM3E in the 2026-2027 timeframe, potentially reducing China's reliance on Samsung, SK hynix, and Micron, the global memory industry's big-three.

Meanwhile, Tongfu Microelectronics is moving into HBM assembly, adding to the domestic capabilities in this critical area. The packaging chain for HBM is also being built domestically, with firms like CXMT, Wuhan Xinxin, and Tongfu Microelectronics developing HBM packaging methods.

However, the advancement of Chinese HBM beyond the domestic market will depend on tool availability and customer qualification. The U.S. has been implementing stricter controls around Chinese fabs, as demonstrated by TSMC's Nanjing plant losing fast-track status. Additionally, the U.S. Bureau of Industry and Security added controls on HBM in its December 2024 rulemaking.

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As China continues to invest in its domestic semiconductor industry, the future of HBM production looks promising. With collaborations between YMTC and CXMT, as well as the growth of domestic firms like Tongfu Microelectronics, China is poised to make significant strides in this critical technology.

Chinese companies YMTC and CXMT collaborate to boost native HBM production in China, combining their hybrid bonding and DRAM technology expertise.